1 dual n-channel 2.5-v (g-s) mosfet features ? halogen-free option av ailable ? trenchfet ? power mosfets p r oduct summary v ds (v) r ds(on) ( )i d (a ) 20 0.022 at v gs = 4.5 v 6.5 0.030 at v gs = 2.5 v 5.5 notes: a. surfa c e mounted on fr4 board, t 10 s. * pb containing terminations are not rohs compliant, exemptions may apply. absolute maximum ratings t a = 25 c, unless otherwise noted p arameter symb ol 10 s steady state unit drain-source voltage v ds 20 v gat e -source voltage v gs 12 continuous d rain current (t j = 150 c ) a t a = 25 c i d 6.5 5 .2 a t a = 70 c 5.5 3 .5 pulsed drain current i dm 30 contin uous sou rce current (diode conduction) a i s 1.5 1 .0 maximum power dissipation a t a = 25 c p d 1.5 1 .0 w t a = 70 c 0.96 0 .64 operating junction and storage temperature range t j , t stg - 55 to 150 c thermal resist ance ratings p a rameter symbol typ. max. unit maximum junction-to-ambient a t 10 s r thj a 72 83 c /w steady state 100 120 maximum junction-to-foot (drain) steady state r thjf 55 70 a v ailab le pb-free rohs* compliant dt . w ww.daysemi.jp n -channel mosfet g 1 d 1 s 1 n -channel mosfet g 2 d 2 s 2 d 1 g 1 d 1 d 2 g 2 d 2 so -8 5 6 7 8 to p v iew 2 3 4 1 s 1 s 2
2 no t es: a. for design aid only; not subject to production testing. b. pulse test; pulse width 300 s, duty cycle 2 %. st resses beyond those listed under ?absolute maximum ratings? ma y cause permanent damage to the device. these are stress rating s only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. ty pi cal characteristics 25 c, unless otherwise noted specif ications t j = 25 c, unless otherwise noted p a rameter symbol test conditions min. typ. a max. u nit static gate t h reshold voltage v gs(th) v ds = v gs , i d = 250 a 0.6 1.6 v gate-body leakage i gs s v ds = 0 v , v gs = 4.5 v 200 na zero gate voltage drain current i ds s v ds = 20 v , v gs = 0 v 1 a v ds = 2 0 v, v gs = 0 v , t j = 70 c 25 on-state drain current b i d(o n) v ds 5 v , v gs = 4.5 v 30 a dr ain-source on-state resistance b r ds( o n) v gs = 4.5 v, i d = 6.5 a 0.0165 0.022 v gs = 2 . 5 v, i d = 5.5 a 0.023 0.030 forward transconductance b g fs v ds = 10 v , i d = 6.5 a 30 s diode f orward voltage b v sd i s = 1.5 a, v gs = 0 v 0.71 1.2 v dynam ic a to tal gate charge q g v ds = 10 v , v gs = 4.5 v , i d = 6.5 a 12 18 nc gate-s ource charge q gs 2.2 gate- dr ain charge q gd 3.6 tu r n - o n d e l ay t i m e t d(o n ) v dd = 10 v , r l = 10 i d ? 1 a, v gen = 4.5 v, r g = 6 245 365 ns rise time t r 330 495 t urn-off delay time t d(of f) 860 1 300 fall time t f 510 765 gate-c urrent vs. gate-so urce voltage 0 2 4 6 8 10 0 3 6 9 12 15 18 - gate current (ma) i gss v gs - gate-to-source voltage (v) gate curren t vs. gate-source voltage 0369 1 2 15 0.01 100 10000 t j = 25 c - gate current (a) i gss 0.1 1 10 1000 v gs - gate-to-source voltage (v) t j = 150 c dt . w ww.daysemi.jp dt . w ww. daysemi.jp
3 typica l c har acteristics 25 c, unless otherwise noted output characteristic s on-resistance vs. drain current on-resistance vs. junction temperature 0 5 10 15 20 25 30 01234 5 v gs = 5 thru 3 v 2 v 2.5 v v ds - dr ain-to-source voltage (v) - dr ain current (a) i d 0.01 0.02 0.03 0.04 0.05 0.06 0 5 10 15 20 25 30 v gs = 4.5 v v gs = 2.5 v - on-resistance ( ) r ds(on) i d - dr ain current (a) 0.6 0.8 1.0 1.2 1.4 1.6 - 50 - 25 0 2 5 5 0 7 5 100 125 150 v gs = 4.5 v i d = 6.5 a t j - j unction temperature (c) (normaliz ed) - on-resistance r ds(on) transfer characteristics gat e charge source-drain diode forward voltage 0 5 10 15 20 25 30 0.0 0.5 1.0 1.5 2.0 2.5 3.0 t c = 125 c - 55 c v gs - gate-to-source voltage (v) - dr ain current (a) i d 25 c 0 1 2 3 4 5 0 3 6 9 12 15 v ds = 10 v i d = 6.5 a - gate-to-source v oltage (v) q g - total gate charge (nc) v gs 1.2 1.5 0.1 10 40 0 0.3 0.6 0.9 t j = 25 c t j = 150 c v sd - source-to-dr ain voltage (v) - source current (a) i s 1 dt . w ww.daysemi.jp
4 ty pi cal characteristics 25 c, unless otherwise noted on-resistan ce vs. gate-to-source voltage single pulse power 0.00 0.01 0.02 0.03 0.04 0.05 0 123 456 i d = 6.5 a - on-resistance ( ) r ds(on) v gs - gate-to-source voltage (v) 0.001 0 1 160 200 80 10 0.1 p o wer (w) t ime (s) 40 120 0.01 thre shold voltage safe operating area, junction-to-case - 0.6 - 0.4 - 0.2 0.0 0.2 0.4 - 50 - 25 0 2 5 5 0 7 5 100 125 150 i d = 250 a v ar iance (v) v gs(th) t j - temperature (c ) 100 1 0.1 1 1 0 100 0.01 10 1 ms - dr ain current (a) i d 0.1 limited b y r ds( on) * t c = 25 c single pulse 10 ms 100 ms dc 10 s 1 s v ds - drain -to-source voltage (v) *v gs > minimum v gs at which r ds(on) is specified no r malized thermal transient impedance, junction-to-ambient 2 1 0.1 0.01 10 -4 10 -3 10 -2 10 -1 1 100 600 duty cycle = 0.5 0.2 0.1 0.05 0.02 single pulse 1. duty cycle, d = 2. p er unit base = r th j a = 1 1 5 c/w 3. t jm - t a = p dm z th j a (t ) t 1 t 2 t 1 t 2 notes: 4. surface mounted p dm square w ave pulse duration (s) nor maliz ed ef fective t ransient thermal impedance 10 dt . w ww.daysemi.jp
5 typica l c haracteristics 25 c, unless otherwise noted norm alize d thermal transient impedance, junction-to-foot 10 -3 10 -2 11 0 10 -1 10 -4 2 1 0.1 0.01 0.2 0.1 0.05 0.02 single pulse duty cycle = 0.5 square w ave pulse duration (s) nor maliz ed eff ective transient thermal impedance dt . w ww.daysemi.jp
www. daysemi.jp 1 dim millimeters inch es min max min max a 1.35 1.7 5 0.053 0.069 a 1 0.10 0.2 0 0.00 4 0.008 b 0.35 0.51 0.014 0.020 c 0.19 0.25 0.0075 0.010 d 4.80 5.00 0.189 0.196 e 3.80 4.00 0.150 0.157 e 1.27 bsc 0.050 bsc h 5.80 6.20 0.228 0.244 h 0.25 0.50 0.010 0.020 l 0.50 0.93 0.020 0.037 q0 8 0 8 s 0.44 0.64 0.018 0.026 ecn: c-06527-rev. i, 11-sep-06 dwg: 5498 4 3 1 2 5 6 8 7 h e h x 45 c all le a d s q 0.101 mm 0.004" l ba 1 a e d 0.25 mm (g a ge pl a ne) s oic (narrow): 8-lead jedec p a rt n u m b er: m s -012 s package information
www .daysemi.jp 1 application note recommen ded minimum pads for so-8 0.246 (6.248) recommended mi nimum pads dimensions in inches/(mm) 0.172 (4.369) 0.152 (3.861) 0.047 (1.194) 0.028 (0.71 1) 0.050 (1.270) 0.022 (0.559) return to index r e turn to index application note
legal disclaimer notice www. daysemi.jp 1 disclaimer all product, product specifications and data are subject to change without notice to improve reliability, function or design or otherwise. din-tek intertechnology, inc., its affiliates, agents, and employee s, and all persons acting on it s or their behalf (collectivel y, din-tek ), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any o ther disclosure relating to any product. din-tek makes no warranty, repres entation or guarantee regarding the suitabilit y of the products for any particular purpose or the continuing production of any product. to the maximum extent permitted by applicable law, din-tek disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation specia l, consequential or incidental damages, and (iii) any and all i mplied warranties, including warra nties of fitness for particular purpose, non-infringement and merchantability. statements regarding the suitability of products for certain type s of applications are based on din-tek s knowledge of typical requirements that are often placed on din-tek products in generic applications. such statements are not binding statements about the suitability of products for a particular application. it is the customers responsib ility to validate that a particu lar product with the properties descri bed in the product specification is suitable fo r use in a particular application. parameters provided in datasheets and/or specification s may vary in different applications an d performance may vary over time. all operating parameters, including typical pa rameters, must be validated for each customer application by the customers technical experts. product specifications do not expand or otherwise modify din-tek s terms and condit ions of purchase, including but not limited to the warranty expressed therein. except as expressly indicate d in writing, din-tek products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the din-tek product could result in personal injury or death. customers using or selling din-tek products not expressly indicated for use in such applications do so at their own risk. pleas e contact authorized din-tek personnel to ob tain written terms and conditions regarding products designed for such applications. no license, express or implied, by estoppel or otherwise, to any intellectual prope rty rights is granted by this document or by any conduct of din-tek . product names and markings noted herein may be trad emarks of their respective owners. material category policy din-tek intertechnology, inc. hereby certi fies that all its products that are id entified as rohs-compliant fulfill the definitions and restrictions defined under directive 2011/65/eu of the euro pean parliament and of the council of june 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (eee) - recast, unless otherwis e specified as non-compliant. please note that some din-tek documentation may still make reference to rohs directive 2002/95/ ec. we confirm that all the products identified as being compliant to directive 2002 /95/ec conform to directive 2011/65/eu. din-tek intertechnology, inc. hereby certifi es that all its products that are identified as ha logen-free follow halogen-free requirements as per jedec js709a stan dards. please note that some din-tek documentation may still make reference to the iec 61249-2-21 definition. we co nfirm that all the products identified as being compliant to iec 61249-2-21 conform to jedec js709a standards. legal disclaimer notice www.daysemi.jp revision: 02-oct-12 1 document number: 72610 disclaimer all product, product specifications and data are subject to change without notice to improve reliability, function or design or otherwise. din-tek intertechnology, inc., its affiliates, agents, and employee s, and all persons acting on it s or their behalf (collectivel y, din-tek ), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any o ther disclosure relating to any product. din-tek makes no warranty, repres entation or guarantee regarding the suitabilit y of the products for any particular purpose or the continuing production of any product. to the maximum extent permitted by applicable law, din-tek disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation specia l, consequential or incidental damages, and (iii) any and all i mplied warranties, including warra nties of fitness for particular purpose, non-infringement and merchantability. statements regarding the suitability of products for certain type s of applications are based on din-tek s knowledge of typical requirements that are often placed on din-tek products in generic applications. such statements are not binding statements about the suitability of products for a particular application. it is the customers responsib ility to validate that a particu lar product with the properties descri bed in the product specification is suitable fo r use in a particular application. parameters provided in datasheets and/or specification s may vary in different applications an d performance may vary over time. all operating parameters, including typical pa rameters, must be validated for each customer application by the customers technical experts. product specifications do not expand or otherwise modify din-tek s terms and condit ions of purchase, including but not limited to the warranty expressed therein. except as expressly indicate d in writing, din-tek products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the din-tek product could result in personal injury or death. customers using or selling din-tek products not expressly indicated for use in such applications do so at their own risk. pleas e contact authorized din-tek personnel to ob tain written terms and conditions regarding products designed for such applications. no license, express or implied, by estoppel or otherwise, to any intellectual prope rty rights is granted by this document or by any conduct of din-tek . product names and markings noted herein may be trad emarks of their respective owners. material category policy din-tek intertechnology, inc. hereby certi fies that all its products that are id entified as rohs-compliant fulfill the definitions and restrictions defined under directive 2011/65/eu of the euro pean parliament and of the council of june 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (eee) - recast, unless otherwis e specified as non-compliant. please note that some din-tek documentation may still make reference to rohs directive 2002/95/ ec. we confirm that all the products identified as being compliant to directive 2002 /95/ec conform to directive 2011/65/eu. din-tek intertechnology, inc. hereby certifi es that all its products that are identified as ha logen-free follow halogen-free requirements as per jedec js709a stan dards. please note that some din-tek documentation may still make reference to the iec 61249-2-21 definition. we co nfirm that all the products identified as being compliant to iec 61249-2-21 conform to jedec js709a standards.
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